行业：半导体电子

Semiconductor Electronic Gas Safety Monitoring Integrated Solution

行业痛点

半导体电子是国家"卡脖子"技术核心赛道，同时是特种气体（电子气体 + 大宗气体）使用最复杂、风险最高的行业：① **晶圆 fab**：硅烷 SiH4（自燃，与空气接触瞬间燃烧）+ 磷化氢 PH3（剧毒 IDLH 50 ppm）+ 氯气 Cl2 + HCl + HF + NH3 + 氢气 + 氘气 + 三氯化硼 + 三氟化氯 50+ 种特气；② **特气供应间（GAS BAY）**：上百只特气钢瓶集中存放 + 自动切换装置 + VMB 阀门箱，任一泄漏触发 fab 24 小时停机（停机损失 1-2 亿美元 / 天）；③ **面板 / 显示**：H2 + Ar + N2 + 化学气相沉积（CVD）所用 SiH4 + B2H6；④ **PCB 厂**：HCl + H2SO4 烟雾 + Cl2（蚀刻）+ 氨水（曝光显影）；⑤ **超净环境**：洁净度 ISO 4-5（0.1μm 颗粒数 < 100/m³）+ AMC 控制至 ppt（万亿分之一）级。监管层面 SEMI S6 国际半导体安全标准 + GB 50457 + 应急管理局 + 园区监管，零容忍标准。

方案概述

优锐安半导体专版方案严格符合 SEMI S6 + SEMI S2 + GB 50457：① **特气供应间（GAS BAY）**：每瓶气体专用电化学 / 红外探头 + 自动切换 VMB 阀门箱联动（剧毒泄漏自动切阀 + 隔离 + 通风冲淡）+ 双重独立监测冗余（A 系统 + B 系统）+ ppb 级灵敏度（PH3 0.1 ppm 即触发 PC-TWA）；② **晶圆 fab 工艺区**：CVD / PVD / 刻蚀 / 离子注入各工艺站点专用气体探头 + 真空线泄漏监测 + 排气 scrubber 燃尽率验证；③ **面板厂 / OLED**：H2 + 有机蒸汽 + 颗粒 + 防静电；④ **PCB 制造**：HCl / Cl2 烟雾 + 风量 + 排气塔 pH 联动；⑤ **AMC 极致控制**：硅 / 硼 / 钠 / 硫 / 氯 / 氟 / 氨各类 AMC ppt 级在线监测，符合 ITRS / SEMI 规格；⑥ **EMS 集成**：所有数据汇聚晶圆厂 EMS / FMCS（设施监控系统），与 MES（制造执行系统）联动，泄漏直接停产线。设备防爆 Ex d IIC T6 + SEMI S2 安全 + UL 认证。

## Key Monitoring Nodes

### Gas Bay (highest risk)

**Electronic Toxic Gas Detector** (Regulatory Core):
– **Phosphine (PH3)**: electrochemical sensor, 0-5 ppm, PC-TWA 0.3 mg/m³ (≈ 0.2 ppm), ppb-level trigger
– **Arsine AsH3**: 0-5 ppm, highly toxic
– **Silane SiH4**: 0-100% LEL (autoignition + explosion)
– **Borane B2H6**: 0-30 ppm, highly toxic
– **Hydrogen Chloride (HCl)**: 0-50 ppm
– **Chlorine trifluoride ClF3**: 0-10 ppm (strong oxidizer, spontaneously ignites with organic compounds)
– **Boron Trichloride BCl3**: 0-30 ppm

**Bulk Gases**:
– N2 / Ar oxygen deficiency (O2 < 19.5%) - H2 LEL (semiconductor is widely used) - Cl2 + NH3 (CMP polishing / etching) ### Process Station (Inside the Fab) - **CVD / Epitaxy**: SiH4 + B2H6 + GeH4 + PH3 compounding - **Etching**: Cl2 + HBr + BCl3 + CF4 / SF6 - **Ion implantation**: PH3 + AsH3 + B2H6 + BF3 - **CMP (Chemical-Mechanical Polishing)**: H2O2 + NH3 + particulate matter - **Vacuum pump room**: pump body leakage + N2 oxygen deficiency - **Inlet/outlet of exhaust scrubber**: processing efficiency ≥ 99.9% verified ### AMC Control (Core of Wafer Yield) - Silicon (Si) / Boron (B) / Sodium (Na) / Sulfur (S) / Chlorine (Cl) / Fluorine (F) / Ammonia (NH3) at ppt levels - Online IMS (Ion Mobility Spectrometry) + Offline GC-MS / IC (Ion Chromatography) - Key areas: lithography room (DUV/EUV optical sensitive) + yellow light area + measurement room ### PCB Factory - Etching line: HCl + Cl2 + air volume + exhaust tower pH - Development line: ammonia + VOC - Gold plating / copper deposition: hydrogen cyanide (highly toxic) + nickel hydrochloric acid mist ## Key Technical Specifications - Explosion-proof: Ex d IIC T6 (covering IIC gases such as H2 / SiH4) - SEMI S2 Safety Standard + UL 1604 / IECEx Certification - Range: Electronic toxic gas detection with ppb-level sensitivity (measuring from 0.01 ppm for PH3 / AsH3) - Response time: T90 < 5 seconds (critical time window for highly toxic + flammable gases) - Operating temperature: clean workshop environment, 18-25℃ ± 0.5℃ - Communication: EtherCAT + Modbus + EthernetIP, interfacing with EMS / FMCS / MES - Dual redundancy: The key monitoring points A and B are independent systems, ensuring that a single point failure does not compromise safety ## Implementation Essentials (Determining Success or Failure) 1. **Zero false alarms are a must**: a 1-day fab shutdown can result in a loss of $100-200 million, with a false alarm rate < 0.5% per month 2. **Automatic Leak Interlock**: In the event of a highly toxic leak, immediately close the corresponding VMB valve + activate the scrubber + notify EHS + isolate the area 3. **AMC ppt-level control**: Even a 1 ppt silicon contamination in DUV lithography can affect yield, necessitating multi-point sampling coupled with real-time ion chromatography analysis 4. **Lifecycle Support**: fab design - construction - commissioning - mass production - decommissioning (10-15 years), requiring service support across 5 stages 5. **SEMI S6 Compliance**: All gas monitoring station locations + alarm thresholds + linkage logic must comply with SEMI S6. Failure to meet the standards will result in failure to pass fab acceptance 6. **Data Access**: All data is uploaded to the central EMS 24/7 and backed up to the cloud, with the emergency management bureau's supervision platform interfaced ## Regulatory Basis - SEMI S6 "Guidelines for Environmental, Health, and Safety Design of Semiconductor Manufacturing Equipment" - SEMI S2 "Guidelines for the Safety Design of Semiconductor Equipment Personnel" - GB 50457-2019 "Design Standard for Cleanrooms in Pharmaceutical Industry" (also applicable to semiconductor industry) - GB 50058-2014 Electrical Apparatus for Explosive Gas Atmospheres - ISO 14644 clean room standard - ITRS International Technology Roadmap for Semiconductors (AMC Control Specification) - GBZ 2.1-2019 Limit Values ## Applicable Customers Fab factories (SMIC / Hua Hong / Yangtze Memory Technologies / Changxin Memory / San'an Optoelectronics / China Resources Microelectronics / Silan Micro / Yandong Micro); Panels (BOE / CSOT / Visionox / TCL Huaxing / Tianma); OLED (BOE / Visionox / Hehui Optoelectronics); PCB (Pengding / Hu Dian / Jingwang / Shennan Circuit); Compound Semiconductor / Third-Generation Semiconductor (San'an / Haiwei Huaxin / Wentai); Power Semiconductor (China Resources Microelectronics / BYD Semiconductor / Hua Hong Hongli); Semiconductor Equipment Factory (Beifang Huachuang / MicroSense / Tuojing / Yitang).